Discover how 3D packaging power modules enhance power density, thermal performance, and efficiency in next-generation HPC systems https://www.usiglobal.com/en/b....log/hpc-3d-packaging
Discover how 3D packaging power modules enhance power density, thermal performance, and efficiency in next-generation HPC systems https://www.usiglobal.com/en/b....log/hpc-3d-packaging
USI (Universal Scientific Industrial) has been at the forefront of electronic design and manufacturing the world over. The company is acclaimed for its advanced System-in-Package (SiP) technology and comprehensive end-to-end technology solutions. Established in 1976, the firm is the one-stop solution to all the needs which cover product design, miniaturization, manufacturing, supply-chain management, logistics, and after-sales support. https://www.usiglobal.com/en
USI (Universal Scientific Industrial) has been at the forefront of electronic design and manufacturing the world over. The company is acclaimed for its advanced System-in-Package (SiP) technology and comprehensive end-to-end technology solutions. Established in 1976, the firm is the one-stop solution to all the needs which cover product design, miniaturization, manufacturing, supply-chain management, logistics, and after-sales support. USI has more than 30 production and service sites worldwide and is a preferred partner for top brands across various industries like wireless communications, cloud and storage, consumer electronics, industrial equipment, medical technology, automotive electronics, IoT, and wearables. Innovation and sustainability are at the core of USI's values. The company manages to take the most complicated engineering challenges and come up with simple and efficient solutions, thereby enabling the next generation of connected devices to be powered.